winintec

Semiconductor package target, design guide provision and SI/PI simulation verification
SI/PI analysis and design of mass production test board(Intel x86 series) for DIMM (up to 3200)
SI/PI analysis and design of mass production test board(Intel x86 series) for LPDDR4x (up to 4267)
Development and delivery of PCIe-gen4 (16Gbps) Test Jig
Signal integrity analysis and design improvement of 25G Ethernet eSSD board I/F
SI/PI analysis and design of mass production test board(Intel x86 series) for SSD of PCIe gen4
Development and delivery of ESD noise absorber
High-speed analysis/design of B-to-B Connector for 5G smartphone
Preparation and management of ECAE qualification test in the field of SI/PI/EMC
SI/PI analysis and design for NAND Interposer development
Digital device development for portable image detection (national project)
SI/PI analysis and design and joint development of test equipment for DDR4 mass production
SI/PI/EMC design, development and provision of robot controller for semiconductor production-line
SI/PI analysis and design of probe system for wafer level memory
EMI countermeasure design for WPT System
SI/PI design and verification for Chrome-Book PCB
Noise countermeasures and design for vehicle electric devices
EMC/RFI improvement and design guide development for Electronic Control Suspension System(ECS)
EMC improvement of Motor-Driven Power Steering(MDPS)
EMS improvement of All Around View System (company I)
Development of SI/PI/EMC analysis technology and design guide for PKG/PCB of vehicle electric devices
PI/EMI analysis and consulting for Hybrid Power Control Unit(HPCU) of next generation HEV/EV(company O)
Consulting for SI/PI/EMC design technology (company S in China)

Samsung Electronics Advanced Technology Training Center :Design training for SI/PI/EMC (Since 2002, 6 or more times/year)
Samsung Electronics VD Division : Practical training for System SI/PI/EMC (Since 2019)
Hyundai Mobis : SI/PI/EMC design training for vehicle electric devices (Since 2012, 6 or more times/year)
Mando Human Resources Development Institute: Design training for SI/PI/EMC
Hyundai Otron : EMC design and analysis
Hyundai-Kia Motors: PI, SI, EMI circuit design theory and practice
Electromagnetic Wave Technology Institute : EMC design and countermeasure technology training
Samsung Electro-Mechanics : High-speed circuit design and countermeasures considering SI, PI, and EMI
LG Electronics : SI/PI/EMC design and countermeasure technology training
SoC Industry Promotion Center: SiP (System in Package) design and verification technology considering SI and PI
Korea University of Education and Technology: Basic course of PCB design analysis (SI/PI/EMI)
Overseas education (China): SI/PI/EMI design education for Chinese engineers at Samsung Electronics
Overseas Education (Taiwan): : Sunplus, Signal integrity and EMI design for chip, package, and PCB

Multi-GHz EMI countermeasure design and IC level RFI evaluation technology development
Elementary technology development for wafer probing board development
IC level technology development of conductive noise measurement and evaluation
Establishment of PCB design EMC standards for automotive electronic systems
SI/PI design development for multi-Gbps semiconductor test board
Design technology development against PBA Intra-EMI
Online-electric vehicle design against low-frequency EM noise (Ministry of Land, Transport and Maritime Affairs: 3 years)
Co-simulation technology development including Chip/Package/PCB/Module
Wafer-level 3D IC design and integration technology (Ministry of Knowledge Economy)
DDR3 Test Interface board development
Development of component EMI evaluation technology and correlation analysis technology between chip noise and EMI
Satellite Lab in the field of noise analysis technology for vehicle electronic devices
Module R&D using EM simulation
Noise flow analysis to improve reception sensitivity performance
A design plan for EMI countermeasure in 2-layer PCB
PCB design and evaluation technology research for EMI suppression of PDP (Plasma Display Panel)
High-performance, ultra-small SiP (System in Package) SI/PI/EMI technology development (Ministry of Information and Communication)